This is the Section 4 Module 3 of the compiled Electronics Coaching Materials taken from different sources including but not limited to Electronics books, past Board Exams Questions, Journals and other Electronics References. This particular Coaching Notes in Electronics Engineering has random Questions and Answers in random topics. Make sure to familiarize each questions to increase the chance of passing the ECE Board Exam.
Electronics Engineering Coaching: Section 4 Module 3
SOLID STATE DEVICES and CIRCUITS (BJT/FET/MOSFET)
1. In JFET, the transconductance is the ratio of ______
CHANGE IN DRAIN CURRENT OVER THE CHANGE IN THE GATE VOLTAGE
2. MOSFET vs JFET
MOSFETS CAN HANDLE A WIDE RANGE OF BIAS VOLTAGE
3. Field-effect transistor combining the depletion mode properties and enhancement mode properties
MESFET
4. Signal diode can operate satisfactorily from front-to-back ratio or back-to-front ratio.
300 to 1
5. Ratio of small change of zener voltage with the small change of zener current
ZENER DYNAMIC IMPEDANCE
6. Cutting and peeling is an easy way to remove what kind of coating?
SILICONE
7. In n-channel JFET, pinch-off occurs when the gate bias is
VERY NEGATIVE
8. If gate source voltage is zero, the current that flows in the JFET is
DRAIN SOURCE SATURATION CURRENT
9. Bipolar transistor and JFET in multivibrator are in
COMMON-EMITTER AND COMMON-SOURCE CONNECTION
10. Used in most voltage regulators as their control element
BJT
11. The input saturates the transistor. This will __
REDUCE EFFICIENCY
12. The hfe of a bipolar transistor corresponds to
BETA
13. Current gain in common collector is called______.
GAMMA
14. _____ configuration is used as a stable RF power amplifier
COMMON BASE
15. To obtain a high input impedance, ____ configuration is used
COMMON COLLECTOR
16. When looking for good voltage gain and high input resistance _____ must be used
COMMON-SOURCE AMPLIFIER
17. Transient suppression avoid the risk of _____
DIODE FAILURE
18. Checking of transistor become cumbersome when more than one is defective
SUBSTITUTION METHOD
19. Emitter junction produced on the base layer of the mesa transistor
VACUUM EVAPORATION OR DIFFUSION
20. Solid without crystalline formation
AMORPHOUS
ELECTRONIC (AUDIO/RF) CIRCUIT/ANALYSIS/DESIGN
(Oscillators & Multivibrators, Feedbacks, Amplifiers, Attenuators, Filters)
1. Two split capacitance parallel with an inductance
COLPITTS
2. Used in Op amp differential amplifier.
RESISTOR
3. Purpose of a varactor
TUNING A GUNN-DIODE OSCILLATOR
4. In an op-amplifier, the peak value decreases when _____
POWER BANDWIDTH INCREASES
5. A voltage follower amplifier has a voltage gain of_____.
UNITY
6. Voltage amplifier is also called as
PRE-AMPLIFIER
7. Voltage gain is practically expressed in
dB UNITS
8. The voltage gain of an amplifier is expressed in
dB units
9. Current supplied in the input of an amplifier
INPUT BIAS CURRENT
10. What is the closest value of MPP of an op-amp if its two supply voltages are ± 18V?
36 V
11. Typical external frequency-compensating capacitance on op-amps
3 – 30 PF
12. Rate of output voltage of op-amp with respect to input signal
SLEW RATE
13. In amplifiers, it is made with compensating circuit,… the reason for high open loop gain…. (mahabayungtanong)
ROLL OFF
14. A 74IC op-amp unity loop gain frequency is
1 MHZ
15. An LF 157A is a/an _____ op amp
BIFET
16. In inverter amplifier, the closed loop voltage is equal to
FEEDBACK RESISTANCE DIVIDED BY INPUT RESISTANCE
17. Preventing the compensating capacitor in OP AMP
OSCILLATION
18. Bandpass, bandstop, high pass or low pass filter characterized by flat pass and high attenuation..
BUTTERWORTH FILTER
19. Frequency of the crystal depends on the _______
THICKNESS OF THE CRYSTAL
20. Rejects the band and allows the upper and lower frequency to pass. Also known as band suppression and band rejection filter.
BANDSTOP FILTER
21. A filter that allows a narrow band of frequency to pass through the circuit and rejects or attenuates the frequencies that is below or above the frequency range.
BANDPASS FILTER
22. The main disadvantage of single balance mixer is that ____________.
INPUT IS NOT COMPLETELY ISOLATED
MICROELECTRONICS
1. A technology that uses an extremely small elements…
MICROELECTRONICS
2. Electronic system which consists extremely small elements
MICROELECTRONICS
3. An assembly of microcircuit or combination of microcircuit and discrete components
MICROCIRCUIT MODULE
4. Name and letter fabricated in the body of the IC provide what information.
USE
5. Letters and number stamped on body of an IC serve to provide which of the following types of information?
USE
6. A compound of Gallium and Arsenide that is used in manufacturing microwave frequency integrated circuit, monolithic microwave frequency integrated circuit, and others…. :]
GALLIUM ARSENIDE
7. Conformal coating is said to be thin if it is less than what thickness?
0.025 inch
8. The most popular op-amp packages are the metal can,8-pin DIP and the SMT. Which of these corresponds to TO-99?
METAL CAN
9. Plug-in DIPs are susceptible to loosening because of which of the following causes?
VIBRATION
10. Layer of aligned atoms used as coating in IC production.
EPITAXIAL LAYER
11. When there is no input signal, IC is minimum
WHEN E-B IS REVERSE BIASED
12. Maximum number of IC in large scale integration
2000
13. In IC fabrication, gold and aluminum are used to
TO CONNECT PACKET LEADS
14. In IC, lead is protected from contamination during fabrication process by which of the following material
OXIDE
15. Approximate typical diameter and thickness of silicon wafer
2” ; 0.01”- 0.02”
16. A device that allows the depositing of material in selected areas of a semiconductor substrate, but not in others is known as a
WAFER MASK
17. The most complex to produce and difficult to repair printed circuit boards are those made using which of the following methods
LAYER BUILD UP METHOD
18. Advantage of IC over discrete components
HIGHER ATTAINABLE SWITCHING SPEED
19. Assembly of microelectronics or combination of microelectronics and discrete component is referred as _______
MICROCIRCUIT MODULE
20. Recommended way of removing imbedded TOs
PULL OUT GENTLY
21. Deposition of a highly radiated material in wafer
VACUUM EVAPORATION
22. A single chip with dual 555 timer built in.
556
23. Plastic insulation is commonly used in what voltage level?
MEDIUM TO LOW
24. . . ___ Total heat if electrodes.
TWO THIRDS
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